Yixing City Jitai Electronics Co., Ltd.
Main products:FIBER OPTIC PACKAGE,SENSOR HEADER,CAN-FLAT-FORM METAL PACKAGE,PLUG-IN PLATFORM METAL PACKAGE FOR HIC,CIRCULAR METAL PACKAGE FOR HIC
Products
Contact Us
  • Contact Person : Mr. pei ping
  • Company Name : Yixing City Jitai Electronics Co., Ltd.
  • Tel : 0086-0510-87186095
  • Fax : 0086-0510-87188295
  • Address : Jiangsu,Yixing,Jiangsu Province Yixing City Dingshu Town
  • Country/Region : China
  • Zip : 214221

Other Packaging Materials
Flat Packages

Flat Packages

Metal sealing Material:4J29(FeNiCo) alloy/WCu alloy. Surface plating:Ni/Au plating,selective Au plating.  Flat Packages   Application areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwave...
Can-flat form Metal Package

Can-flat form Metal Package

Can-flat form Metal Package Material:4J29(FeNiCo) alloy/WCu alloy. Surface plating:Ni/Au plating,selective Au plating. Can-flat form Metal PackageApplication areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwave...
Sensitive electronics sealing

Sensitive electronics sealing

Sensitive electronics sealing Material:4J29(FeNiCo) alloy/WCu alloy. Surface plating:Ni/Au plating,selective Au plating. Sensitive electronics sealingApplication areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwave...
Metal sealing

Metal sealing

Metal sealing Material:4J29(FeNiCo) alloy/WCu alloy. Surface plating:Ni/Au plating,selective Au plating. Metal sealingApplication areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwave devices,suitable for labeing and...
CIRCULAR METAL PACKAGE FOR HIC

CIRCULAR METAL PACKAGE FOR HIC

Circular metal package Material:4J29(FeNiCo) alloy/WCu alloy. Surface plating:Ni/Au plating,selective Au plating. Circular metal packageApplication areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwave devices,suitable for...
Butterfly Package

Butterfly Package

Butterfly Package Application areas: Monolithic integrated circuit Hybrid integrated circuits package Microwave devices. Butterfly PackageGeneral information:1.Application areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in...


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