Yixing City Jitai Electronics Co., Ltd.
Main products:FIBER OPTIC PACKAGE,SENSOR HEADER,CAN-FLAT-FORM METAL PACKAGE,PLUG-IN PLATFORM METAL PACKAGE FOR HIC,CIRCULAR METAL PACKAGE FOR HIC
Products
Contact Us
  • Contact Person : Mr. pei ping
  • Company Name : Yixing City Jitai Electronics Co., Ltd.
  • Tel : 0086-0510-87186095
  • Fax : 0086-0510-87188295
  • Address : Jiangsu,Yixing,Jiangsu Province Yixing City Dingshu Town
  • Country/Region : China
  • Zip : 214221

Other Electronic Accessories
Glass-to-metal sealing

Glass-to-metal sealing

Glass-to-metal sealing Material:4J29(FeNiCo) alloy. Surface plating:Ni/Au plating,selective Au plating. Glass-to-metal sealingApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) ...
Metal Package

Metal Package

Metal Package Material:4J29(FeNiCo) alloy. Surface plating:Ni/Au plating,selective Au plating. Metal PackageApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo)  alloy.Surface...
Hermetic housings

Hermetic housings

Hermetic housings Material:4J29(FeNiCo) alloy. Surface plating:Ni/Au plating,selective Au plating. Hermetic housingsApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo)  alloy.Surface...
Uni-Body Packages

Uni-Body Packages

Hermetic housings Material:4J29(FeNiCo) alloy. Surface plating:Ni/Au plating,selective Au plating. Hermetic housingsApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo)  alloy.Surface...
Electronic packaging

Electronic packaging

Electronic packaging Material:4J29(FeNiCo) alloy. Surface plating:Ni/Au plating,selective Au plating. Electronic packagingApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) ...
Metal packaging

Metal packaging

Metal packaging Material:4J29(FeNiCo) alloy. Surface plating:Ni/Au plating,selective Au plating. Metal packagingApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo)  alloy.Surface...


Copyright Notice @ 2008-2022 ECOL Limited and/or its subsidiaries and licensors. All rights reserved.